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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    24-6508-301

    24-6508-301

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    0
    RFQ
    24-6508-301

    Tabla de datos

    508 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-6621-30

    12-6621-30

    CONN IC DIP SOCKET 12POS TIN

    Aries Electronics

    0
    RFQ
    12-6621-30

    Tabla de datos

    6621 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Bottom Entry; Through Board Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-0501-30

    25-0501-30

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    0
    RFQ
    25-0501-30

    Tabla de datos

    501 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    25-0501-20

    25-0501-20

    CONN SOCKET SIP 25POS TIN

    Aries Electronics

    0
    RFQ
    25-0501-20

    Tabla de datos

    501 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-0501-20

    21-0501-20

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    0
    RFQ
    21-0501-20

    Tabla de datos

    501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    21-0501-30

    21-0501-30

    CONN SOCKET SIP 21POS TIN

    Aries Electronics

    0
    RFQ
    21-0501-30

    Tabla de datos

    501 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8490-310C

    14-8490-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-8490-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    14-8910-310C

    14-8910-310C

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    0
    RFQ
    14-8910-310C

    Tabla de datos

    8 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    16-0508-21

    16-0508-21

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-0508-21

    Tabla de datos

    508 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    16-0508-31

    16-0508-31

    CONN SOCKET SIP 16POS GOLD

    Aries Electronics

    0
    RFQ
    16-0508-31

    Tabla de datos

    508 Bulk Active SIP 16 (1 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
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