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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    28-3518-102

    28-3518-102

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,693
    RFQ
    28-3518-102

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    34-0518-00

    34-0518-00

    CONN SOCKET SIP 34POS GOLD

    Aries Electronics

    3,467
    RFQ
    34-0518-00

    Tabla de datos

    518 Bulk Active SIP 34 (1 x 34) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    34-1518-00

    34-1518-00

    CONN IC DIP SOCKET 34POS GOLD

    Aries Electronics

    4,259
    RFQ
    34-1518-00

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 34 (2 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    18-0508-20

    18-0508-20

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,891
    RFQ
    18-0508-20

    Tabla de datos

    508 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-0508-30

    18-0508-30

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,681
    RFQ
    18-0508-30

    Tabla de datos

    508 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-1508-20

    18-1508-20

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    2,732
    RFQ
    18-1508-20

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-1508-30

    18-1508-30

    CONN IC DIP SOCKET 18POS GOLD

    Aries Electronics

    3,619
    RFQ
    18-1508-30

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    18-6820-90T

    18-6820-90T

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    4,898
    RFQ
    18-6820-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    24-0511-10

    24-0511-10

    CONN SOCKET SIP 24POS TIN

    Aries Electronics

    4,534
    RFQ
    24-0511-10

    Tabla de datos

    511 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    10-2822-90T

    10-2822-90T

    CONN IC DIP SOCKET 10POS TIN

    Aries Electronics

    3,368
    RFQ
    10-2822-90T

    Tabla de datos

    Vertisockets™ 800 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6 -
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