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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    22-0513-11H

    22-0513-11H

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    3,997
    RFQ
    22-0513-11H

    Tabla de datos

    0513 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-C212-10

    28-C212-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,893
    RFQ
    28-C212-10

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    28-C300-10

    28-C300-10

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    4,473
    RFQ
    28-C300-10

    Tabla de datos

    EJECT-A-DIP™ Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    12-0503-20

    12-0503-20

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    4,945
    RFQ
    12-0503-20

    Tabla de datos

    0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    12-0503-30

    12-0503-30

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    4,175
    RFQ
    12-0503-30

    Tabla de datos

    0503 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA), Nylon, Glass Filled -
    28-0518-00

    28-0518-00

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    4,041
    RFQ
    28-0518-00

    Tabla de datos

    518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    28-1518-00

    28-1518-00

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,678
    RFQ
    28-1518-00

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0518-11H

    24-0518-11H

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    2,270
    RFQ
    24-0518-11H

    Tabla de datos

    518 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    02-0511-11

    02-0511-11

    CONN SOCKET SIP 2POS GOLD

    Aries Electronics

    2,730
    RFQ
    02-0511-11

    Tabla de datos

    511 Bulk Active SIP 2 (1 x 2) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    06-2503-21

    06-2503-21

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,819
    RFQ
    06-2503-21

    Tabla de datos

    503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 125°C
    Total 4131 Record«Prev1... 104105106107108109110111...414Next»
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