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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    12-1508-30

    12-1508-30

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    3,033
    RFQ
    12-1508-30

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    ICF-318-S-O-TR

    ICF-318-S-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,223
    RFQ
    ICF-318-S-O-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-318-SM-O-TR

    ICF-318-SM-O-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    4,014
    RFQ
    ICF-318-SM-O-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    ICF-318-S-I-TR

    ICF-318-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,402
    RFQ
    ICF-318-S-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    28-0518-11

    28-0518-11

    CONN SOCKET SIP 28POS GOLD

    Aries Electronics

    3,970
    RFQ
    28-0518-11

    Tabla de datos

    518 Bulk Active SIP 28 (1 x 28) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    614-87-950-31-012101

    614-87-950-31-012101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    4,644
    RFQ
    614-87-950-31-012101

    Tabla de datos

    614 Bulk Active DIP, 0.9" (22.86mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-314-ZMGT

    ICO-314-ZMGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,307
    RFQ
    ICO-314-ZMGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-422-WTT-2

    ICA-422-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,604
    RFQ
    ICA-422-WTT-2

    Tabla de datos

    ICA Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICA-322-WTT-2

    ICA-322-WTT-2

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    3,098
    RFQ
    ICA-322-WTT-2

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-428-41-009101

    116-83-428-41-009101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,681
    RFQ
    116-83-428-41-009101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PGA132H012B1-1414R

    PGA132H012B1-1414R

    PGA SOCKET 132 CTS

    Amphenol ICC (FCI)

    2,110
    RFQ
    PGA132H012B1-1414R

    Tabla de datos

    - - Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Through Hole Open Frame - - - - - - -
    ICA-328-SGT

    ICA-328-SGT

    CONN IC DIP SOCKET 28POS GOLD

    Samtec Inc.

    3,509
    RFQ
    ICA-328-SGT

    Tabla de datos

    ICA Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    614-83-642-31-012101

    614-83-642-31-012101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,212
    RFQ
    614-83-642-31-012101

    Tabla de datos

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0207-T-10

    HLS-0207-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    3,533
    RFQ
    HLS-0207-T-10

    Tabla de datos

    HLS Tube Active SIP 14 (2 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    ICF-320-S-I-TR

    ICF-320-S-I-TR

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    3,030
    RFQ
    ICF-320-S-I-TR

    Tabla de datos

    ICF Tape & Reel (TR) Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    116-83-628-41-001101

    116-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,550
    RFQ
    116-83-628-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    10-6513-11H

    10-6513-11H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    4,664
    RFQ
    10-6513-11H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    08-2503-20

    08-2503-20

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    4,668
    RFQ
    08-2503-20

    Tabla de datos

    503 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    ICA-320-ZWTT

    ICA-320-ZWTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,346
    RFQ
    ICA-320-ZWTT

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    510-87-132-14-001101

    510-87-132-14-001101

    CONN SOCKET PGA 132POS GOLD

    Preci-Dip

    2,724
    RFQ
    510-87-132-14-001101

    Tabla de datos

    510 Bulk Active PGA 132 (14 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 267268269270271272273274...955Next»
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