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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    116-87-424-41-004101

    116-87-424-41-004101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,359
    RFQ
    116-87-424-41-004101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-628-41-007101

    116-83-628-41-007101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    3,169
    RFQ
    116-83-628-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    06-0508-21

    06-0508-21

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    3,768
    RFQ
    06-0508-21

    Tabla de datos

    508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    06-0508-31

    06-0508-31

    CONN SOCKET SIP 6POS GOLD

    Aries Electronics

    4,333
    RFQ
    06-0508-31

    Tabla de datos

    508 Bulk Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    06-1508-21

    06-1508-21

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,359
    RFQ
    06-1508-21

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    06-1508-31

    06-1508-31

    CONN IC DIP SOCKET 6POS GOLD

    Aries Electronics

    2,801
    RFQ
    06-1508-31

    Tabla de datos

    508 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 125°C
    PLCC-044-T-A

    PLCC-044-T-A

    CONN SOCKET PLCC 44POS TIN

    Samtec Inc.

    4,925
    RFQ
    PLCC-044-T-A

    Tabla de datos

    PLCC Tube Obsolete PLCC 44 (4 x 11) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    28-3518-11

    28-3518-11

    CONN IC DIP SOCKET 28POS GOLD

    Aries Electronics

    2,221
    RFQ
    28-3518-11

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-83-650-41-005101

    110-83-650-41-005101

    CONN IC DIP SOCKET 50POS GOLD

    Preci-Dip

    3,334
    RFQ
    110-83-650-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 50 (2 x 25) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-624-MTT

    ICO-624-MTT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,003
    RFQ
    ICO-624-MTT

    Tabla de datos

    ICO Tube Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-308-ZCGT

    ICO-308-ZCGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,018
    RFQ
    ICO-308-ZCGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    21-0513-11

    21-0513-11

    CONN SOCKET SIP 21POS GOLD

    Aries Electronics

    3,079
    RFQ
    21-0513-11

    Tabla de datos

    0513 Bulk Active SIP 21 (1 x 21) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    24-0513-10H

    24-0513-10H

    CONN SOCKET SIP 24POS GOLD

    Aries Electronics

    4,340
    RFQ
    24-0513-10H

    Tabla de datos

    0513 Bulk Active SIP 24 (1 x 24) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    19-0518-11H

    19-0518-11H

    CONN SOCKET SIP 19POS GOLD

    Aries Electronics

    4,464
    RFQ
    19-0518-11H

    Tabla de datos

    518 Bulk Active SIP 19 (1 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    40-1518-10H

    40-1518-10H

    CONN IC DIP SOCKET 40POS GOLD

    Aries Electronics

    4,299
    RFQ
    40-1518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-652-41-006101

    116-87-652-41-006101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    3,101
    RFQ
    116-87-652-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    2134146-2

    2134146-2

    CONN SOCKET PGA 989POS GOLD

    TE Connectivity AMP Connectors

    3,612
    RFQ
    2134146-2

    Tabla de datos

    - Tape & Reel (TR) Obsolete PGA 989 (35 x 36) 0.157" (4.00mm) Gold Flash Copper Alloy Surface Mount Open Frame Solder 0.157" (4.00mm) Tin-Lead Flash Copper Alloy Thermoplastic -
    10-6513-10H

    10-6513-10H

    CONN IC DIP SOCKET 10POS GOLD

    Aries Electronics

    3,754
    RFQ
    10-6513-10H

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 10 (2 x 5) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    17-0518-00

    17-0518-00

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    2,937
    RFQ
    17-0518-00

    Tabla de datos

    518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    32-1518-10T

    32-1518-10T

    CONN IC DIP SOCKET 32POS GOLD

    Aries Electronics

    4,421
    RFQ
    32-1518-10T

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    Total 19086 Record«Prev1... 245246247248249250251252...955Next»
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