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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    1571550-7

    1571550-7

    CONN IC DIP SOCKET 22POS TIN

    TE Connectivity AMP Connectors

    4,942
    RFQ
    1571550-7

    Tabla de datos

    500 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    2-1571550-7

    2-1571550-7

    CONN IC DIP SOCKET 22POS GOLD

    TE Connectivity AMP Connectors

    2,694
    RFQ
    2-1571550-7

    Tabla de datos

    500 Tube Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    3-1571550-0

    3-1571550-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    2,646
    RFQ
    3-1571550-0

    Tabla de datos

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    3-1571550-1

    3-1571550-1

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    3,148
    RFQ
    3-1571550-1

    Tabla de datos

    500 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 25.0µin (0.63µm) Beryllium Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    506-AG11D-ESL-LF

    506-AG11D-ESL-LF

    CONN IC DIP SOCKET 6POS GOLD

    TE Connectivity AMP Connectors

    2,800
    RFQ
    506-AG11D-ESL-LF

    Tabla de datos

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 6 (2 x 3) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    3-1571551-0

    3-1571551-0

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    2,559
    RFQ
    3-1571551-0

    Tabla de datos

    500 Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold Flash Nickel Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    5-1571552-1

    5-1571552-1

    CONN IC DIP SOCKET 36POS GOLD

    TE Connectivity AMP Connectors

    2,396
    RFQ
    5-1571552-1

    Tabla de datos

    800 Tube Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 20.0µin (0.51µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 20.0µin (0.51µm) Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    824-AG32D-LF

    824-AG32D-LF

    CONN IC DIP SOCKET 24POS TIN

    TE Connectivity AMP Connectors

    2,304
    RFQ
    824-AG32D-LF

    Tabla de datos

    800 Tube Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Copper Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 105°C
    1-1825108-3

    1-1825108-3

    CONN IC DIP SOCKET 40POS GOLD

    TE Connectivity AMP Connectors

    2,331
    RFQ

    -

    Diplomate DL Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    3-1825276-2

    3-1825276-2

    CONN IC DIP SOCKET 32POS GOLD

    TE Connectivity AMP Connectors

    2,744
    RFQ
    3-1825276-2

    Tabla de datos

    Diplomate DL Tray Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Thermoplastic, Glass Filled -55°C ~ 125°C
    Total 702 Record«Prev1... 5859606162636465...71Next»
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