Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
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814-AG11D-ESCONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
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800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | 80.0µin (2.03µm) | Copper Alloy | Polyester | -55°C ~ 105°C |
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1-1814640-7CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
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- | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Brass | Thermoplastic, Polyester | -55°C ~ 125°C |
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5-1437539-3CONN IC DIP SOCKET 20POS GOLD TE Connectivity AMP Connectors |
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800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | - | - | - | Polyester | -55°C ~ 105°C |
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508-AG10D-ESLCONN IC DIP SOCKET 8POS GOLD TE Connectivity AMP Connectors |
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500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 8 (2 x 4) | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 5.00µin (0.127µm) | Brass | - | -55°C ~ 125°C |
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643644-6CONN SOCKET SIP 12POS TIN TE Connectivity AMP Connectors |
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Diplomate DL | Tray | Obsolete | SIP | 12 (1 x 12) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Thermoplastic, Glass Filled | -55°C ~ 105°C |
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2-640361-2CONN IC DIP SOCKET 24POS GOLD TE Connectivity AMP Connectors |
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Diplomate DL | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Thermoplastic | -55°C ~ 125°C |
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9-1437535-4CONN IC DIP SOCKET 14POS GOLD TE Connectivity AMP Connectors |
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500 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 14 (2 x 7) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | - | -55°C ~ 125°C |
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2-916783-5CONN SOCKET PGA ZIF 370POS GOLD TE Connectivity AMP Connectors |
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- | Tray | Obsolete | PGA, ZIF (ZIP) | 370 (19 x 19) | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Gold | 15.0µin (0.38µm) | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - |
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1571539-2CONN SOCKET PLCC 28POS TIN TE Connectivity AMP Connectors |
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- | Bulk | Obsolete | PLCC | 28 (4 x 7) | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | Tin | 180.0µin (4.57µm) | Copper Alloy | Polyphenylene Sulfide (PPS), Glass Filled | -55°C ~ 125°C |
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818-AG11D-ESCONN IC DIP SOCKET 18POS GOLD TE Connectivity AMP Connectors |
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800 | Tube | Obsolete | DIP, 0.3" (7.62mm) Row Spacing | 18 (2 x 9) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Copper Alloy | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin-Lead | - | Copper Alloy | Polyester | -55°C ~ 105°C |