Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    117-43-620-41-005000

    117-43-620-41-005000

    CONN IC DIP SOCKET 20POS GOLD

    Mill-Max Manufacturing Corp.

    3,047
    RFQ
    117-43-620-41-005000

    Tabla de datos

    117 Tube Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.070" (1.78mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    APO-320-T-J

    APO-320-T-J

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,117
    RFQ
    APO-320-T-J

    Tabla de datos

    APO Tube Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    APO-308-T-R

    APO-308-T-R

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    3,441
    RFQ
    APO-308-T-R

    Tabla de datos

    APO Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    30-0518-10T

    30-0518-10T

    CONN SOCKET SIP 30POS GOLD

    Aries Electronics

    2,856
    RFQ
    30-0518-10T

    Tabla de datos

    518 Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    HLS-0108-G-22

    HLS-0108-G-22

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,960
    RFQ
    HLS-0108-G-22

    Tabla de datos

    HLS Tube Active SIP 8 (1 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    110-83-652-41-001101

    110-83-652-41-001101

    CONN IC DIP SOCKET 52POS GOLD

    Preci-Dip

    2,225
    RFQ
    110-83-652-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 52 (2 x 26) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-83-430-41-105101

    117-83-430-41-105101

    CONN IC DIP SOCKET 30POS GOLD

    Preci-Dip

    3,250
    RFQ
    117-83-430-41-105101

    Tabla de datos

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICA-628-ZSTT

    ICA-628-ZSTT

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,575
    RFQ
    ICA-628-ZSTT

    Tabla de datos

    ICA Tube Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    ICO-308-ZNGT

    ICO-308-ZNGT

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,121
    RFQ
    ICO-308-ZNGT

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    20-6513-11

    20-6513-11

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    3,884
    RFQ
    20-6513-11

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    20-0513-11

    20-0513-11

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    2,053
    RFQ
    20-0513-11

    Tabla de datos

    0513 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    23-0513-10H

    23-0513-10H

    CONN SOCKET SIP 23POS GOLD

    Aries Electronics

    2,617
    RFQ
    23-0513-10H

    Tabla de datos

    0513 Bulk Active SIP 23 (1 x 23) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-4518-10M

    20-4518-10M

    CONN IC DIP SOCKET 20POS GOLD

    Aries Electronics

    4,925
    RFQ
    20-4518-10M

    Tabla de datos

    518 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-0518-10H

    38-0518-10H

    CONN SOCKET SIP 38POS GOLD

    Aries Electronics

    2,771
    RFQ
    38-0518-10H

    Tabla de datos

    518 Bulk Active SIP 38 (1 x 38) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    38-1518-10H

    38-1518-10H

    CONN IC DIP SOCKET 38POS GOLD

    Aries Electronics

    3,081
    RFQ
    38-1518-10H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 38 (2 x 19) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-108-12-051101

    510-87-108-12-051101

    CONN SOCKET PGA 108POS GOLD

    Preci-Dip

    2,093
    RFQ
    510-87-108-12-051101

    Tabla de datos

    510 Bulk Active PGA 108 (12 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0106-G-32

    HLS-0106-G-32

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,224
    RFQ
    HLS-0106-G-32

    Tabla de datos

    HLS Tube Active SIP 6 (1 x 6) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    116-87-632-41-007101

    116-87-632-41-007101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,843
    RFQ
    116-87-632-41-007101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    PLCC-052-T-N

    PLCC-052-T-N

    CONN SOCKET PLCC 52POS TIN

    Samtec Inc.

    2,541
    RFQ
    PLCC-052-T-N

    Tabla de datos

    PLCC Tube Obsolete PLCC 52 (4 x 13) 0.050" (1.27mm) Tin - Beryllium Copper Surface Mount Closed Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    APA-320-T-J

    APA-320-T-J

    ADAPTER PLUG

    Samtec Inc.

    2,179
    RFQ
    APA-320-T-J

    Tabla de datos

    APA Tube Active - 20 (2 x 10) 0.100" (2.54mm) Tin - Phosphor Bronze Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Phosphor Bronze Polybutylene Terephthalate (PBT), Glass Filled -
    Total 19086 Record«Prev1... 238239240241242243244245...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios