Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo | Número de posiciones o clavijas (cuadrícula) | Paso: acoplamiento | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Material del contacto: acoplamiento | Tipo de montaje | Características | Terminación | Paso: poste | Acabado del contacto: poste | Espesor del acabado del contacto: poste | Material del contacto: Poste | Material de la carcasa | Temperatura de funcionamiento |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
510-87-100-11-001101CONN SOCKET PGA 100POS GOLD |
0 |
|
![]() Tabla de datos |
510 | Bulk | Active | PGA | 100 (11 x 11) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
299-83-610-10-002101CONN IC DIP SOCKET 10POS GOLD |
0 |
|
![]() Tabla de datos |
299 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 10 (2 x 5) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
ICF-628-TM-O-TR.100" SURFACE MOUNT SCREW MACHIN |
0 |
|
![]() Tabla de datos |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
![]() |
ICF-628-T-I-TR.100" SURFACE MOUNT SCREW MACHIN |
0 |
|
![]() Tabla de datos |
ICF | Tape & Reel (TR) | Active | DIP, 0.6" (15.24mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
![]() |
116-87-624-41-011101CONN IC DIP SOCKET 24POS GOLD |
0 |
|
![]() Tabla de datos |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
20-1518-00CONN IC DIP SOCKET 20POS GOLD |
0 |
|
![]() Tabla de datos |
518 | Bulk | Active | DIP, 0.2" (5.08mm) Row Spacing | 20 (2 x 10) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
35-0518-10HCONN SOCKET SIP 35POS GOLD |
0 |
|
![]() Tabla de datos |
518 | Bulk | Active | SIP | 35 (1 x 35) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
40-0518-10HCONN SOCKET SIP 40POS GOLD |
0 |
|
![]() Tabla de datos |
518 | Bulk | Active | SIP | 40 (1 x 40) | 0.100" (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled | - |
![]() |
614-87-650-41-001101CONN IC DIP SOCKET 50POS GOLD |
0 |
|
![]() Tabla de datos |
614 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 50 (2 x 25) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
212-1-24-006CONN IC DIP SOCKET 24POS GOLD |
0 |
|
![]() Tabla de datos |
- | Tube | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) | -40°C ~ 105°C |
![]() |
299-87-612-10-002101CONN IC DIP SOCKET 12POS GOLD |
0 |
|
![]() Tabla de datos |
299 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 12 (2 x 6) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
510-87-088-12-051101CONN SOCKET PGA 88POS GOLD |
0 |
|
![]() Tabla de datos |
510 | Bulk | Active | PGA | 88 (12 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
510-87-088-12-052101CONN SOCKET PGA 88POS GOLD |
0 |
|
![]() Tabla de datos |
510 | Bulk | Active | PGA | 88 (12 x 12) | 0.100" (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
116-83-328-41-012101CONN IC DIP SOCKET 28POS GOLD |
0 |
|
![]() Tabla de datos |
116 | Bulk | Active | DIP, 0.3" (7.62mm) Row Spacing | 28 (2 x 14) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
7-1437536-2CONN IC DIP SOCKET 36POS GOLD |
0 |
|
![]() Tabla de datos |
500 | Tube | Obsolete | DIP, 0.6" (15.24mm) Row Spacing | 36 (2 x 18) | 0.100" (2.54mm) | Gold | 25.0µin (0.63µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | Brass | - | -55°C ~ 125°C |
![]() |
114-83-642-41-117101CONN IC DIP SOCKET 42POS GOLD |
0 |
|
![]() Tabla de datos |
114 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 42 (2 x 21) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
ICF-316-F-O.100" SURFACE MOUNT SCREW MACHIN |
0 |
|
![]() Tabla de datos |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 3.00µin (0.076µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
![]() |
ICF-316-F-I.100" SURFACE MOUNT SCREW MACHIN |
0 |
|
![]() Tabla de datos |
ICF | Tube | Active | DIP, 0.3" (7.62mm) Row Spacing | 16 (2 x 8) | 0.100" (2.54mm) | Gold | 3.00µin (0.076µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) | -55°C ~ 125°C |
![]() |
116-83-624-41-002101CONN IC DIP SOCKET 24POS GOLD |
0 |
|
![]() Tabla de datos |
116 | Bulk | Active | DIP, 0.6" (15.24mm) Row Spacing | 24 (2 x 12) | 0.100" (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100" (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | -55°C ~ 125°C |
![]() |
HLS-0204-T-31.100" SCREW MACHINE SOCKET ARRAY |
0 |
|
![]() Tabla de datos |
HLS | Tube | Active | SIP | 8 (2 x 4) | 0.100" (2.54mm) | Tin | - | - | Through Hole | Closed Frame | Solder | 0.100" (2.54mm) | - | - | - | Thermoplastic | -55°C ~ 140°C |