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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    123-87-328-41-001101

    123-87-328-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,421
    RFQ
    123-87-328-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    22-0518-11

    22-0518-11

    CONN SOCKET SIP 22POS GOLD

    Aries Electronics

    2,259
    RFQ
    22-0518-11

    Tabla de datos

    518 Bulk Active SIP 22 (1 x 22) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    22-1518-11

    22-1518-11

    CONN IC DIP SOCKET 22POS GOLD

    Aries Electronics

    2,034
    RFQ
    22-1518-11

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    ICO-308-SGT-L

    ICO-308-SGT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    4,394
    RFQ
    ICO-308-SGT-L

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    ICA-308-SGT-L

    ICA-308-SGT-L

    .100" SCREW MACHINE DIP SOCKET

    Samtec Inc.

    4,865
    RFQ
    ICA-308-SGT-L

    Tabla de datos

    ICA Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 10.0µin (0.25µm) Brass Polyester, Glass Filled -55°C ~ 125°C
    612-83-624-41-001101

    612-83-624-41-001101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,143
    RFQ
    612-83-624-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-432-41-003101

    116-87-432-41-003101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,120
    RFQ
    116-87-432-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0304-TT-11

    HLS-0304-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,173
    RFQ
    HLS-0304-TT-11

    Tabla de datos

    HLS Tube Active SIP 12 (3 x 4) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    16-3513-00

    16-3513-00

    CONN IC DIP SOCKET 16POS GOLD

    Aries Electronics

    2,506
    RFQ
    16-3513-00

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    110-83-328-41-105101

    110-83-328-41-105101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,010
    RFQ
    110-83-328-41-105101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    400-040-050

    400-040-050

    CONN IC DIP SOCKET 40POS GOLD

    3M

    4,529
    RFQ
    400-040-050

    Tabla de datos

    400 Box Obsolete DIP, 0.6" (15.24mm) Row Spacing 40 (2 x 20) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Open Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    115-83-632-41-003101

    115-83-632-41-003101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    2,616
    RFQ
    115-83-632-41-003101

    Tabla de datos

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-636-41-006101

    116-87-636-41-006101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    3,495
    RFQ
    116-87-636-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-322-41-012101

    116-83-322-41-012101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    4,627
    RFQ
    116-83-322-41-012101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    20-3511-10

    20-3511-10

    CONN IC DIP SOCKET 20POS TIN

    Aries Electronics

    4,649
    RFQ
    20-3511-10

    Tabla de datos

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    614-83-628-41-001101

    614-83-628-41-001101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,364
    RFQ
    614-83-628-41-001101

    Tabla de datos

    614 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-648-41-117101

    114-87-648-41-117101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    2,870
    RFQ
    114-87-648-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    24-3513-10T

    24-3513-10T

    CONN IC DIP SOCKET 24POS GOLD

    Aries Electronics

    2,259
    RFQ
    24-3513-10T

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    116-83-624-41-003101

    116-83-624-41-003101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,688
    RFQ
    116-83-624-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-432-41-006101

    116-87-432-41-006101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    3,660
    RFQ
    116-87-432-41-006101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 196197198199200201202203...955Next»
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