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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    AR 48 HZL/07-TT

    AR 48 HZL/07-TT

    CONN IC DIP SOCKET 48POS GOLD

    Assmann WSW Components

    0
    RFQ
    AR 48 HZL/07-TT

    Tabla de datos

    - Bag Obsolete DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Thermoplastic, Polyester -40°C ~ 105°C
    08-3518-11H

    08-3518-11H

    CONN IC DIP SOCKET 8POS GOLD

    Aries Electronics

    0
    RFQ
    08-3518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    116-87-632-41-018101

    116-87-632-41-018101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-632-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-324-41-002101

    116-87-324-41-002101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    116-87-324-41-002101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-648-41-001101

    115-87-648-41-001101

    CONN IC DIP SOCKET 48POS GOLD

    Preci-Dip

    0
    RFQ

    -

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-3511-10

    18-3511-10

    CONN IC DIP SOCKET 18POS TIN

    Aries Electronics

    0
    RFQ
    18-3511-10

    Tabla de datos

    511 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 18 (2 x 9) 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    HLS-0112-TT-11

    HLS-0112-TT-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    0
    RFQ
    HLS-0112-TT-11

    Tabla de datos

    HLS Tube Active SIP 12 (1 x 12) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - - Thermoplastic -55°C ~ 140°C
    SIP050-1X30-160B

    SIP050-1X30-160B

    1X30-160B-SIP SOCKET 30 CTS

    Amphenol ICC (FCI)

    0
    RFQ
    SIP050-1X30-160B

    Tabla de datos

    SIP050-1x Bulk Active SIP 30 (1 x 30) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -
    25-0513-10T

    25-0513-10T

    CONN SOCKET SIP 25POS GOLD

    Aries Electronics

    0
    RFQ
    25-0513-10T

    Tabla de datos

    0513 Bulk Active SIP 25 (1 x 25) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-0518-11H

    12-0518-11H

    CONN SOCKET SIP 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-0518-11H

    Tabla de datos

    518 Bulk Active SIP 12 (1 x 12) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    12-1518-11H

    12-1518-11H

    CONN IC DIP SOCKET 12POS GOLD

    Aries Electronics

    0
    RFQ
    12-1518-11H

    Tabla de datos

    518 Bulk Active DIP, 0.2" (5.08mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    110-99-648-41-001000

    110-99-648-41-001000

    CONN IC DIP SOCKET 48POS TINLEAD

    Mill-Max Manufacturing Corp.

    0
    RFQ
    110-99-648-41-001000

    Tabla de datos

    110 Tube Active DIP, 0.6" (15.24mm) Row Spacing 48 (2 x 24) 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin-Lead 200.0µin (5.08µm) Brass Alloy Polycyclohexylenedimethylene Terephthalate (PCT), Polyester -55°C ~ 125°C
    116-83-324-41-018101

    116-83-324-41-018101

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    0
    RFQ
    116-83-324-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-632-41-001101

    115-83-632-41-001101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    0
    RFQ

    -

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-636-41-001101

    110-83-636-41-001101

    CONN IC DIP SOCKET 36POS GOLD

    Preci-Dip

    0
    RFQ
    110-83-636-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-432-41-117101

    114-83-432-41-117101

    CONN IC DIP SOCKET 32POS GOLD

    Preci-Dip

    0
    RFQ
    114-83-432-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 32 (2 x 16) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    299-87-312-10-001101

    299-87-312-10-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    0
    RFQ
    299-87-312-10-001101

    Tabla de datos

    299 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-83-428-41-003101

    115-83-428-41-003101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    0
    RFQ
    115-83-428-41-003101

    Tabla de datos

    115 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    540-44-068-24-000000

    540-44-068-24-000000

    CONN SOCKET PLCC 68POS TIN

    Mill-Max Manufacturing Corp.

    0
    RFQ
    540-44-068-24-000000

    Tabla de datos

    540 Tube Obsolete PLCC 68 (4 x 17) 0.050" (1.27mm) Tin 150.0µin (3.81µm) Copper Alloy Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 150.0µin (3.81µm) Copper Alloy Polyphenylene Sulfide (PPS) -55°C ~ 125°C
    IC-316-SGT

    IC-316-SGT

    CONN IC DIP SOCKET 16POS GOLD

    Samtec Inc.

    0
    RFQ
    IC-316-SGT

    Tabla de datos

    IC Bulk Obsolete DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 189190191192193194195196...955Next»
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