Sesión o Registro
    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    510-87-064-08-000101

    510-87-064-08-000101

    CONN SOCKET PGA 64POS GOLD

    Preci-Dip

    2,823
    RFQ
    510-87-064-08-000101

    Tabla de datos

    510 Bulk Active PGA 64 (8 x 8) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-328-41-117101

    114-83-328-41-117101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,727
    RFQ
    114-83-328-41-117101

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-83-328-41-134161

    114-83-328-41-134161

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,165
    RFQ
    114-83-328-41-134161

    Tabla de datos

    114 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    07-0508-20

    07-0508-20

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    4,645
    RFQ
    07-0508-20

    Tabla de datos

    508 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    07-0508-30

    07-0508-30

    CONN SOCKET SIP 7POS GOLD

    Aries Electronics

    2,727
    RFQ
    07-0508-30

    Tabla de datos

    508 Bulk Active SIP 7 (1 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    AJ 64-HZL-T

    AJ 64-HZL-T

    SOCKET

    Assmann WSW Components

    3,701
    RFQ

    -

    - Bulk Active DIP, 0.75" (19.05mm) Row Spacing 64 (2 x 32) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin 196.9µin (5.00µm) Brass Polyphenylene Sulfide (PPS) -40°C ~ 105°C
    110-83-628-41-005101

    110-83-628-41-005101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    2,324
    RFQ
    110-83-628-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-628-41-605101

    110-83-628-41-605101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,521
    RFQ
    110-83-628-41-605101

    Tabla de datos

    110 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    215-1-14-003

    215-1-14-003

    CONN IC DIP SOCKET 14POS GOLD

    CNC Tech

    4,631
    RFQ
    215-1-14-003

    Tabla de datos

    - Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold - Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT) -55°C ~ 105°C
    HLS-0203-T-11

    HLS-0203-T-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    4,591
    RFQ
    HLS-0203-T-11

    Tabla de datos

    HLS Tube Active SIP 6 (2 x 3) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    BU240Z-178-HT

    BU240Z-178-HT

    CONN IC DIP SOCKET 24POS GOLD

    On Shore Technology Inc.

    4,061
    RFQ
    BU240Z-178-HT

    Tabla de datos

    BU-178HT Tube Obsolete DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold 78.7µin (2.00µm) Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Copper Flash Brass Polybutylene Terephthalate (PBT), Glass Filled -55°C ~ 125°C
    116-87-420-41-008101

    116-87-420-41-008101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,532
    RFQ
    116-87-420-41-008101

    Tabla de datos

    116 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    ICO-316-STT-L

    ICO-316-STT-L

    .100" LOW PROFILE SCREW MACHINE

    Samtec Inc.

    2,475
    RFQ
    ICO-316-STT-L

    Tabla de datos

    ICO Tube Active DIP, 0.3" (7.62mm) Row Spacing 16 (2 x 8) 0.100" (2.54mm) Tin - Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polyester, Glass Filled -55°C ~ 105°C
    116-83-322-41-003101

    116-83-322-41-003101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,782
    RFQ
    116-83-322-41-003101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-83-314-41-011101

    116-83-314-41-011101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    4,484
    RFQ
    116-83-314-41-011101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    115-87-642-41-001101

    115-87-642-41-001101

    CONN IC DIP SOCKET 42POS GOLD

    Preci-Dip

    3,072
    RFQ

    -

    115 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 42 (2 x 21) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    18-0513-10H

    18-0513-10H

    CONN SOCKET SIP 18POS GOLD

    Aries Electronics

    2,910
    RFQ
    18-0513-10H

    Tabla de datos

    0513 Bulk Active SIP 18 (1 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    20-0518-11

    20-0518-11

    CONN SOCKET SIP 20POS GOLD

    Aries Electronics

    3,336
    RFQ
    20-0518-11

    Tabla de datos

    518 Bulk Active SIP 20 (1 x 20) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    510-87-069-11-001101

    510-87-069-11-001101

    CONN SOCKET PGA 69POS GOLD

    Preci-Dip

    2,948
    RFQ
    510-87-069-11-001101

    Tabla de datos

    510 Bulk Active PGA 69 (11 x 11) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    HLS-0107-T-10

    HLS-0107-T-10

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,734
    RFQ
    HLS-0107-T-10

    Tabla de datos

    HLS Tube Active SIP 7 (1 x 7) 0.100" (2.54mm) Tin - - Through Hole Closed Frame Solder 0.100" (2.54mm) - - - Thermoplastic -55°C ~ 140°C
    Total 19086 Record«Prev1... 184185186187188189190191...955Next»
    Correo electrónico
    Lo que contiene
    KATY Electronic Technology Co., LTD

    Casa

    KATY Electronic Technology Co., LTD

    Productos

    KATY Electronic Technology Co., LTD

    Teléfono

    KATY Electronic Technology Co., LTD

    Usuarios