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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    Zócalos para circuitos integrados

    制造商 Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento















































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































    全部重置
    应用所有
    结果:
    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Número de posiciones o clavijas (cuadrícula) Paso: acoplamiento Acabado de contacto: acoplamiento Espesor del acabado del contacto: acoplamiento Material del contacto: acoplamiento Tipo de montaje Características Terminación Paso: poste Acabado del contacto: poste Espesor del acabado del contacto: poste Material del contacto: Poste Material de la carcasa Temperatura de funcionamiento
    AR 36-HZL/01-TT

    AR 36-HZL/01-TT

    SOCKET

    Assmann WSW Components

    2,434
    RFQ

    -

    AR Bulk Active DIP, 0.6" (15.24mm) Row Spacing 36 (2 x 18) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polybutylene Terephthalate (PBT), Glass Filled -40°C ~ 105°C
    612-83-314-41-001101

    612-83-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,418
    RFQ
    612-83-314-41-001101

    Tabla de datos

    612 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Carrier, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    116-87-312-41-001101

    116-87-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    4,788
    RFQ
    116-87-312-41-001101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    14-3513-10

    14-3513-10

    CONN IC DIP SOCKET 14POS GOLD

    Aries Electronics

    2,683
    RFQ
    14-3513-10

    Tabla de datos

    Lo-PRO®file, 513 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -55°C ~ 105°C
    03-0508-20

    03-0508-20

    CONN SOCKET SIP 3POS GOLD

    Aries Electronics

    3,055
    RFQ
    03-0508-20

    Tabla de datos

    508 Bulk Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6 -55°C ~ 105°C
    HLS-0103-G-11

    HLS-0103-G-11

    .100" SCREW MACHINE SOCKET ARRAY

    Samtec Inc.

    2,223
    RFQ
    HLS-0103-G-11

    Tabla de datos

    HLS Tube Active SIP 3 (1 x 3) 0.100" (2.54mm) Gold 30.0µin (0.76µm) - Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 10.0µin (0.25µm) - Thermoplastic -55°C ~ 140°C
    ICF-308-TM-O

    ICF-308-TM-O

    .100" SURFACE MOUNT SCREW MACHIN

    Samtec Inc.

    2,953
    RFQ
    ICF-308-TM-O

    Tabla de datos

    ICF Tube Active DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Tin - Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Beryllium Copper Liquid Crystal Polymer (LCP) -55°C ~ 125°C
    122-87-314-41-001101

    122-87-314-41-001101

    CONN IC DIP SOCKET 14POS GOLD

    Preci-Dip

    3,097
    RFQ
    122-87-314-41-001101

    Tabla de datos

    122 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 14 (2 x 7) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    117-87-430-41-005101

    117-87-430-41-005101

    CONN IC DIP SOCKET 30POS GOLD

    Preci-Dip

    4,626
    RFQ
    117-87-430-41-005101

    Tabla de datos

    117 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 30 (2 x 15) 0.070" (1.78mm) Gold Flash Beryllium Copper Through Hole Open Frame Solder 0.070" (1.78mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    123-83-312-41-001101

    123-83-312-41-001101

    CONN IC DIP SOCKET 12POS GOLD

    Preci-Dip

    2,835
    RFQ
    123-83-312-41-001101

    Tabla de datos

    123 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 12 (2 x 6) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-320-41-005101

    110-83-320-41-005101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,300
    RFQ
    110-83-320-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-320-41-605101

    110-83-320-41-605101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,995
    RFQ
    110-83-320-41-605101

    Tabla de datos

    110 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    17-0518-10

    17-0518-10

    CONN SOCKET SIP 17POS GOLD

    Aries Electronics

    4,074
    RFQ
    17-0518-10

    Tabla de datos

    518 Bulk Active SIP 17 (1 x 17) 0.100" (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled -
    114-87-624-41-134161

    114-87-624-41-134161

    CONN IC DIP SOCKET 24POS GOLD

    Preci-Dip

    3,386
    RFQ
    114-87-624-41-134161

    Tabla de datos

    114 Bulk Active DIP, 0.6" (15.24mm) Row Spacing 24 (2 x 12) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    508-AG10D-ESL

    508-AG10D-ESL

    CONN IC DIP SOCKET 8POS GOLD

    TE Connectivity AMP Connectors

    2,707
    RFQ
    508-AG10D-ESL

    Tabla de datos

    500 Tube Obsolete DIP, 0.3" (7.62mm) Row Spacing 8 (2 x 4) 0.100" (2.54mm) Gold 5.00µin (0.127µm) Beryllium Copper Through Hole Closed Frame Solder 0.100" (2.54mm) Gold 5.00µin (0.127µm) Brass - -55°C ~ 125°C
    110-83-420-41-005101

    110-83-420-41-005101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,377
    RFQ
    110-83-420-41-005101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    110-83-422-41-001101

    110-83-422-41-001101

    CONN IC DIP SOCKET 22POS GOLD

    Preci-Dip

    2,762
    RFQ
    110-83-422-41-001101

    Tabla de datos

    110 Bulk Active DIP, 0.4" (10.16mm) Row Spacing 22 (2 x 11) 0.100" (2.54mm) Gold 29.5µin (0.75µm) Beryllium Copper Through Hole Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    114-87-328-41-117101

    114-87-328-41-117101

    CONN IC DIP SOCKET 28POS GOLD

    Preci-Dip

    4,683
    RFQ
    114-87-328-41-117101

    Tabla de datos

    114 Tube Active DIP, 0.3" (7.62mm) Row Spacing 28 (2 x 14) 0.100" (2.54mm) Gold Flash Beryllium Copper Surface Mount Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    300-032-000

    300-032-000

    CONN SOCKET SIP 32POS GOLD

    3M

    4,126
    RFQ

    -

    300 - Obsolete SIP 32 (1 x 32) 0.100" (2.54mm) Gold 8.00µin (0.203µm) - Through Hole Closed Frame - 0.100" (2.54mm) Gold 8.00µin (0.203µm) - - -
    116-87-320-41-018101

    116-87-320-41-018101

    CONN IC DIP SOCKET 20POS GOLD

    Preci-Dip

    4,581
    RFQ
    116-87-320-41-018101

    Tabla de datos

    116 Bulk Active DIP, 0.3" (7.62mm) Row Spacing 20 (2 x 10) 0.100" (2.54mm) Gold Flash Beryllium Copper Through Hole Elevated, Open Frame Solder 0.100" (2.54mm) Tin - Brass Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled -55°C ~ 125°C
    Total 19086 Record«Prev1... 140141142143144145146147...955Next»
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