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    KATY Electronic Technology Co., LTD KATY Electronic Technology Co., LTD

    RFI y EMI: contactos, empalmes y juntas

    制造商 Serie Embalaje Estado del producto Tipo Forma Ancho Longitud Altura Material Revestimiento Revestimiento: espesor Método de fijación Temperatura de funcionamiento





























































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































































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    Foto N.º de Parte del Fabricante Disponibilidad Precio Cantidad Hoja de Datos Serie Embalaje Estado del producto Tipo Forma Ancho Longitud Altura Material Revestimiento Revestimiento: espesor Método de fijación Temperatura de funcionamiento
    0C98053817

    0C98053817

    AP,COIL,SNB,USFT,PSA .250X.780X.

    Laird Technologies EMI

    3,162
    RFQ

    -

    - Bulk Active - - - - - - - - - -
    0097065419

    0097065419

    RFI FINGERSTOCK BECU NICKEL SLOT

    Laird Technologies EMI

    3,711
    RFQ

    -

    - Bulk Active Fingerstock - - 12.000" (304.80mm) 0.064" (1.63mm) Beryllium Copper Nickel 299.21µin (7.60µm) Slot 121°C
    14-45DTS-BD-15-NTP

    14-45DTS-BD-15-NTP

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    4,071
    RFQ
    14-45DTS-BD-15-NTP

    Tabla de datos

    - Bulk Active Fingerstock - 0.450" (11.43mm) 15.000" (381.00mm) 0.140" (3.56mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    25-109FSDS-BD-24

    25-109FSDS-BD-24

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    4,219
    RFQ
    25-109FSDS-BD-24

    Tabla de datos

    - Bulk Active Fingerstock - 1.090" (27.69mm) 24.000" (609.60mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    6-S-34TV-BD-24

    6-S-34TV-BD-24

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    3,883
    RFQ
    6-S-34TV-BD-24

    Tabla de datos

    - Bulk Active Fingerstock - 0.340" (8.64mm) 24.000" (609.60mm) 0.060" (1.52mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    25-109C-070-BD-16

    25-109C-070-BD-16

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    4,758
    RFQ
    25-109C-070-BD-16

    Tabla de datos

    - Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    25-109C-120-BD-16

    25-109C-120-BD-16

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    4,140
    RFQ
    25-109C-120-BD-16

    Tabla de datos

    - Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    25-109C-130-BD-16

    25-109C-130-BD-16

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    4,427
    RFQ
    25-109C-130-BD-16

    Tabla de datos

    - Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.250" (6.35mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    0097065519

    0097065519

    RFI FINGERSTOCK BECU SLOT

    Laird Technologies EMI

    4,714
    RFQ
    0097065519

    Tabla de datos

    Clip-On Bulk Active Fingerstock - - - - Beryllium Copper - - Slot 121°C
    3-20T-ZNC-24

    3-20T-ZNC-24

    RFI FINGERSTOCK BECU ZINC ADH

    Leader Tech Inc.

    2,288
    RFQ
    3-20T-ZNC-24

    Tabla de datos

    - Bulk Active Fingerstock - 0.200" (5.08mm) 24.000" (609.60mm) 0.030" (0.76mm) Beryllium Copper Zinc + Clear Chromate Flash Adhesive -55°C ~ 121°C
    0097064017

    0097064017

    RFI FINGERSTOCK BECU TIN CLIP

    Laird Technologies EMI

    4,302
    RFQ

    -

    - Bulk Active Fingerstock - 1.090" (27.69mm) 16.000" (406.40mm) 0.330" (8.38mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
    10-30C-050-DL-BD-16

    10-30C-050-DL-BD-16

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    3,644
    RFQ
    10-30C-050-DL-BD-16

    Tabla de datos

    TechMESH Bulk Active Fingerstock - 0.300" (7.62mm) 16.000" (406.40mm) 0.100" (2.54mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    0097043502

    0097043502

    FINGERSTOCK BECU 24X64MM

    Laird Technologies EMI

    3,314
    RFQ

    -

    - Box Obsolete - Angled 0.945" (24.00mm) 2.520" (64.00mm) - - - - - -
    4090PA51H09600

    4090PA51H09600

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    3,640
    RFQ

    -

    51H Bulk Active Fabric Over Foam D-Shape 0.090" (2.29mm) 8.00' (2.44m) 0.125" (3.18mm) Polyurethane Foam, Nickel-Copper Taffeta (NI/CU) - - Adhesive -40°C ~ 70°C
    32-S-78AH-BD-16

    32-S-78AH-BD-16

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    3,256
    RFQ
    32-S-78AH-BD-16

    Tabla de datos

    - Bulk Active Fingerstock - 0.780" (19.81mm) 16.000" (406.40mm) 0.320" (8.13mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    20-38RBCT-SN-16

    20-38RBCT-SN-16

    RFI FINGERSTOCK BECU TIN ADH

    Leader Tech Inc.

    3,362
    RFQ
    20-38RBCT-SN-16

    Tabla de datos

    - Bulk Active Fingerstock - 0.380" (9.65mm) 16.000" (406.40mm) 0.200" (5.08mm) Beryllium Copper Tin Flash Adhesive -55°C ~ 121°C
    4-53D-BD-16

    4-53D-BD-16

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    2,040
    RFQ
    4-53D-BD-16

    Tabla de datos

    - Bulk Active Fingerstock - 0.530" (13.46mm) 16.000" (406.40mm) 0.040" (1.02mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    4320AC51G04800

    4320AC51G04800

    RFI FOF GASKET PU ADH

    Laird Technologies EMI

    4,115
    RFQ

    -

    51G Bulk Active Fabric Over Foam D-Shape 0.140" (3.56mm) 4.00' (1.22m) 0.050" (1.27mm) Polyurethane Foam, Nickel-Copper Polyester (NI/CU) - - Adhesive -40°C ~ 70°C
    8-92RC-BD-16

    8-92RC-BD-16

    RFI FINGERSTOCK BECU UNPLAT ADH

    Leader Tech Inc.

    3,454
    RFQ
    8-92RC-BD-16

    Tabla de datos

    - Bulk Active Fingerstock - 0.920" (23.37mm) 16.000" (406.40mm) 0.080" (2.03mm) Beryllium Copper Unplated - Adhesive -55°C ~ 121°C
    0098065517

    0098065517

    RFI FINGERSTOCK BECU TIN CLIP

    Laird Technologies EMI

    2,924
    RFQ

    -

    Ultrasoft Clip-On Bulk Active Fingerstock - - 11.945" (303.40mm) 0.305" (7.75mm) Beryllium Copper Tin 299.21µin (7.60µm) Clip 121°C
    Total 4130 Record«Prev1... 146147148149150151152153...207Next»
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