Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo de conector | Tipo de contacto | Estilo | Número de posiciones | Número de posiciones cargadas | Paso: acoplamiento | Número de filas | Espaciado entre filas - Acoplamiento | Tipo de montaje | Terminación | Tipo de sujeción | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Color del aislamiento | Altura de aislamiento | Longitud de contacto - Poste | Temperatura de funcionamiento | Índice de inflamabilidad del material | Alturas de apilamiento acopladas | Protección de ingreso | Características | Clasificación de corriente (amperios) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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YTQ-122-03-H-Q-0502.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc. |
4,900 |
|
![]() Tabla de datos |
YTQ | Tube | Active | Socket | Forked | Board to Board | 88 | 87 | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.250" (6.35mm) | 0.208" (5.28mm) | -55°C ~ 125°C | - | - | - | - | - |
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CLT-136-02-SM-D-BE-ALOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
4,897 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLM-137-02-LM-D-BELOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc. |
4,783 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLM-137-02-L-D-BELOW PROFILE DUAL-WIPE SOCKET, 1. Samtec Inc. |
4,223 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-148-02-S-D-BE-PLOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
3,171 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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ESD-125-G-07CONN SOCKET 50POS 0.1 GOLD PCB Samtec Inc. |
2,556 |
|
![]() Tabla de datos |
ESD | Bulk | Active | Elevated Socket | Female Socket | Board to Board | 50 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.400" (10.16mm) | 0.265" (6.73mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | - |
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CLP-133-02-H-D-BE-PLOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
4,054 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 66 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Pick and Place | 3.3A per Contact |
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YTE-132-02-L-Q-500-0012.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
4,604 |
|
![]() Tabla de datos |
YTE | Tube | Active | Elevated Socket | Forked | Board to Board | 128 | 127 | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.500" (12.70mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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CLT-131-02-H-D-ALOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
2,854 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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ESQT-136-03-G-Q-310CONN SOCKET 144P 0.079 GOLD PCB Samtec Inc. |
4,462 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 144 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.310" (7.87mm) | 0.148" (3.76mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |