Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo de conector | Tipo de contacto | Estilo | Número de posiciones | Número de posiciones cargadas | Paso: acoplamiento | Número de filas | Espaciado entre filas - Acoplamiento | Tipo de montaje | Terminación | Tipo de sujeción | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Color del aislamiento | Altura de aislamiento | Longitud de contacto - Poste | Temperatura de funcionamiento | Índice de inflamabilidad del material | Alturas de apilamiento acopladas | Protección de ingreso | Características | Clasificación de corriente (amperios) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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BCS-145-F-D-DE-BEPASS-THROUGH SOCKET STRIP, 0.100 Samtec Inc. |
4,076 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-119-02-H-D-BELOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
2,248 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLP-146-02-F-DH-ALOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
3,012 |
|
- |
CLP | - | Active | Receptacle | Female Socket | Board to Board | 92 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount, Right Angle | Solder | Push-Pull | Gold | 3.00µin (0.076µm) | Black | 0.135" (3.43mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide | 3.3A per Contact |
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ESQT-139-02-G-T-639CONN SOCKET 117P 0.079 GOLD PCB Samtec Inc. |
3,367 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 117 | All | 0.079" (2.00mm) | 3 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.639" (16.23mm) | 0.211" (5.35mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-139-02-G-T-693CONN SOCKET 117P 0.079 GOLD PCB Samtec Inc. |
3,423 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 117 | All | 0.079" (2.00mm) | 3 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.693" (17.60mm) | 0.157" (4.00mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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CLT-148-02-FM-D-A-KLOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
4,941 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLP-121-02-H-DLOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
2,313 |
|
- |
CLP | - | Active | Receptacle | Female Socket | Board to Board | 42 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact |
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FOLC-110-M1-S-QCONN RCPT 40P 0.05 GOLD SMD T/H Samtec Inc. |
3,746 |
|
- |
FOURRAY™ FOLC | Tube | Active | Receptacle | Female Socket | Board to Board | 40 | All | 0.050" (1.27mm) | 4 | 0.050" (1.27mm) | Surface Mount, Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.185" (4.70mm) | 0.075" (1.91mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 2.6A per Contact |
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ESQT-130-02-G-Q-309CONN SOCKET 120P 0.079 GOLD PCB Samtec Inc. |
2,704 |
|
- |
ESQT | Bulk | Active | Elevated Socket | Forked | Board to Board or Cable | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.309" (7.85mm) | 0.541" (13.74mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-130-02-G-Q-560CONN SOCKET 120P 0.079 GOLD PCB Samtec Inc. |
3,155 |
|
- |
ESQT | Bulk | Active | Elevated Socket | Forked | Board to Board or Cable | 120 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.560" (14.22mm) | 0.290" (7.37mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |