Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo de conector | Tipo de contacto | Estilo | Número de posiciones | Número de posiciones cargadas | Paso: acoplamiento | Número de filas | Espaciado entre filas - Acoplamiento | Tipo de montaje | Terminación | Tipo de sujeción | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Color del aislamiento | Altura de aislamiento | Longitud de contacto - Poste | Temperatura de funcionamiento | Índice de inflamabilidad del material | Alturas de apilamiento acopladas | Protección de ingreso | Características | Clasificación de corriente (amperios) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SOLC-150-02-L-Q-A-PCONN RCPT 200POS 0.05 GOLD SMD Samtec Inc. |
3,514 |
|
- |
FOURRAY™ SOLC | Tube | Active | Receptacle | Forked | Board to Board | 200 | All | 0.050" (1.27mm) | 4 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.160" (4.06mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide, Pick and Place | 2.4A per Contact |
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CLP-132-02-STL-D-BELOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
4,440 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 64 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact |
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CLP-137-02-LTL-DLOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
3,656 |
|
- |
CLP | - | Active | Receptacle | Female Socket | Board to Board | 74 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact |
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BCS-138-S-S-HEPASS-THROUGH SOCKET STRIP, 0.100 Samtec Inc. |
2,961 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLP-145-02-LTL-D-BELOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
4,841 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 90 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact |
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CLT-141-02-FM-D-BE-KLOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
4,317 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-131-02-S-D-BELOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
2,062 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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YTE-110-02-G-5-6852.00 MM FLEXYZ HIGH-DENSITY ELEV Samtec Inc. |
4,361 |
|
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YTE | Bulk | Active | Elevated Socket | Forked | Board to Board | 50 | All | 0.079" (2.00mm) | 5 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.685" (17.40mm) | - | -55°C ~ 105°C | - | - | - | - | - |
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CLT-143-02-LM-D-BE-A-KLOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
4,617 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-142-02-S-D-A-KLOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
2,001 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |