Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo de conector | Tipo de contacto | Estilo | Número de posiciones | Número de posiciones cargadas | Paso: acoplamiento | Número de filas | Espaciado entre filas - Acoplamiento | Tipo de montaje | Terminación | Tipo de sujeción | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Color del aislamiento | Altura de aislamiento | Longitud de contacto - Poste | Temperatura de funcionamiento | Índice de inflamabilidad del material | Alturas de apilamiento acopladas | Protección de ingreso | Características | Clasificación de corriente (amperios) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SD-133-G-1A.100" DOUBLE ROW SCREW MACHINE S Samtec Inc. |
4,092 |
|
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SD | Tube | Active | Receptacle | Female Socket | Board to Board | 66 | All | 0.100" (2.54mm) | 2 | 0.100" (2.54mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | - | 0.360" (9.14mm) | -55°C ~ 125°C | - | - | - | - | - |
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YTQ-113-01-S-52.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc. |
2,534 |
|
![]() Tabla de datos |
YTQ | Bulk | Active | Socket | Forked | Board to Board | 65 | All | 0.079" (2.00mm) | 5 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.250" (6.35mm) | 0.090" (2.29mm) | -55°C ~ 125°C | - | - | - | - | - |
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BCS-117-H-D-DEPASS-THROUGH SOCKET STRIP, 0.100 Samtec Inc. |
2,056 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLT-139-02-FM-D-ALOW PROFILE DUAL WIPE SOCKET, 2. Samtec Inc. |
3,958 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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SQT-140-02-H-DCONN RCPT 80POS 0.079 GOLD PCB Samtec Inc. |
2,738 |
|
- |
SQT | Bulk | Active | Receptacle | Forked | Board to Board or Cable | 80 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 50.0µin (1.27µm) | Black | 0.250" (6.35mm) | 0.600" (15.24mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 5.1A per Contact |
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CLH-123-H-D-DVCLH-123-H-D-DV Samtec Inc. |
4,241 |
|
- |
* | - | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
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CLP-129-02-F-DH-ALOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
3,223 |
|
- |
CLP | - | Active | Receptacle | Female Socket | Board to Board | 58 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount, Right Angle | Solder | Push-Pull | Gold | 3.00µin (0.076µm) | Black | 0.135" (3.43mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide | 3.3A per Contact |
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CLP-143-02-L-D-BE-PALOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
2,226 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 86 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | Board Guide, Pick and Place | 3.3A per Contact |
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ESQT-150-03-F-Q-330CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc. |
2,992 |
|
- |
ESQT | Bulk | Active | Elevated Socket | Forked | Board to Board or Cable | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 3.00µin (0.076µm) | Black | 0.330" (8.38mm) | 0.128" (3.25mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-150-03-F-Q-310CONN SOCKET 200P 0.079 GOLD PCB Samtec Inc. |
2,356 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 200 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 3.00µin (0.076µm) | Black | 0.310" (7.87mm) | 0.148" (3.76mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |