Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo de conector | Tipo de contacto | Estilo | Número de posiciones | Número de posiciones cargadas | Paso: acoplamiento | Número de filas | Espaciado entre filas - Acoplamiento | Tipo de montaje | Terminación | Tipo de sujeción | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Color del aislamiento | Altura de aislamiento | Longitud de contacto - Poste | Temperatura de funcionamiento | Índice de inflamabilidad del material | Alturas de apilamiento acopladas | Protección de ingreso | Características | Clasificación de corriente (amperios) |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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ESQT-125-03-G-Q-310CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
2,167 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.310" (7.87mm) | 0.148" (3.76mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-125-03-G-Q-319CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
2,441 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.319" (8.10mm) | 0.139" (3.53mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-125-03-G-Q-325CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
3,040 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.325" (8.25mm) | 0.133" (3.38mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-125-03-G-Q-335CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
2,876 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.335" (8.51mm) | 0.123" (3.12mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-125-03-G-Q-345CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
3,259 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.345" (8.76mm) | 0.113" (2.87mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-125-03-G-Q-354CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
2,667 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.354" (9.00mm) | 0.104" (2.64mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-125-03-G-Q-355CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
4,561 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.355" (9.02mm) | 0.103" (2.62mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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ESQT-125-03-G-Q-368CONN SOCKET 100P 0.079 GOLD PCB Samtec Inc. |
3,801 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 100 | All | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.368" (9.35mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
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YTQ-132-03-L-Q-0012.00 MM FLEXYZ HIGH-DENSITY SQUA Samtec Inc. |
3,320 |
|
![]() Tabla de datos |
YTQ | Tube | Active | Socket | Forked | Board to Board | 128 | 127 | 0.079" (2.00mm) | 4 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 10.0µin (0.25µm) | Black | 0.250" (6.35mm) | 0.208" (5.28mm) | -55°C ~ 125°C | - | - | - | - | - |
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CLP-124-02-STL-D-BELOW PROFILE DUAL-WIPE SOCKET, .0 Samtec Inc. |
4,865 |
|
- |
CLP | - | Active | Receptacle, Bottom Entry | Female Socket | Board to Board | 48 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact |