| Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo de conector | Tipo de contacto | Estilo | Número de posiciones | Número de posiciones cargadas | Paso: acoplamiento | Número de filas | Espaciado entre filas - Acoplamiento | Tipo de montaje | Terminación | Tipo de sujeción | Acabado de contacto: acoplamiento | Espesor del acabado del contacto: acoplamiento | Color del aislamiento | Altura de aislamiento | Longitud de contacto - Poste | Temperatura de funcionamiento | Índice de inflamabilidad del material | Alturas de apilamiento acopladas | Protección de ingreso | Características | Clasificación de corriente (amperios) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ESQT-115-02-GF-D-310CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
4,894 |
|
- |
ESQT | Bulk | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.310" (7.87mm) | 0.540" (13.72mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-115-02-GF-D-365CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
3,513 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.365" (9.27mm) | 0.485" (12.32mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-115-02-GF-D-375CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
3,883 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.375" (9.53mm) | 0.475" (12.07mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-115-02-GF-D-650CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
3,877 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.650" (16.50mm) | 0.200" (5.08mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-115-02-GF-D-740CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
2,734 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.740" (18.80mm) | 0.110" (2.79mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-115-02-GF-D-760CONN SOCKET 30POS 0.079 GOLD PCB Samtec Inc. |
3,041 |
|
- |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.760" (19.30mm) | 0.090" (2.29mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-115-02-GF-D-730FLEXYZ FLEXIBLE-HEIGHT SOCKET ST Samtec Inc. |
2,002 |
|
Tabla de datos |
ESQT | Bulk | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.730" (18.54mm) | 0.120" (3.05mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-115-02-GF-D-725FLEXYZ FLEXIBLE-HEIGHT SOCKET ST Samtec Inc. |
4,888 |
|
Tabla de datos |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.725" (18.42mm) | 0.125" (3.18mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
ESQT-115-02-GF-D-368FLEXYZ FLEXIBLE-HEIGHT SOCKET ST Samtec Inc. |
4,432 |
|
Tabla de datos |
ESQT | Tube | Active | Elevated Socket | Forked | Board to Board or Cable | 30 | All | 0.079" (2.00mm) | 2 | 0.079" (2.00mm) | Through Hole | Solder | Push-Pull | Gold | 20.0µin (0.51µm) | Black | 0.368" (9.35mm) | 0.482" (12.24mm) | -55°C ~ 125°C | UL94 V-0 | - | - | - | 4.5A per Contact |
|
CLP-113-02-H-DLOW PROFILE DUAL-WIPE SOCKET, 0. Samtec Inc. |
2,497 |
|
Tabla de datos |
CLP | Tube | Active | Receptacle | Female Socket | Board to Board | 26 | All | 0.050" (1.27mm) | 2 | 0.050" (1.27mm) | Surface Mount | Solder | Push-Pull | Gold | 30.0µin (0.76µm) | Black | 0.084" (2.14mm) | - | -55°C ~ 125°C | UL94 V-0 | - | - | - | 3.3A per Contact |