| Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo de conector | Tipo de contacto | Paso: acoplamiento | Número de posiciones | Número de filas | Espaciado entre filas - Acoplamiento | Número de posiciones cargadas | Estilo | Recubrimiento | Tipo de montaje | Terminación | Tipo de sujeción | Longitud de contacto - Acoplamiento | Longitud de contacto - Poste | Longitud total de contacto | Altura de aislamiento | Forma del contacto | Acabado de contacto: acoplamiento | Acabado del contacto: poste | Material de contacto | Material de aislamiento | Características | Clasificación de corriente (amperios) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
TMMH-112-01-S-D-RA-EP2MM LOW PROFILE STRIPS Samtec Inc. |
4,537 |
|
- |
TMMH | Tube | Active | Header, Cuttable | Male Pin | 0.079" (2.00mm) | 24 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.126" (3.20mm) | 0.092" (2.34mm) | - | 0.250" (6.35mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | End Shrouds, Mating Guide | - |
|
TMMH-112-01-S-D-RA-ES2MM LOW PROFILE STRIPS Samtec Inc. |
2,696 |
|
- |
TMMH | Tube | Active | Header, Cuttable | Male Pin | 0.079" (2.00mm) | 24 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.126" (3.20mm) | 0.139" (3.53mm) | - | 0.250" (6.35mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | End Shrouds | - |
|
HMTSW-113-08-G-T-200-RACONN HEADER R/A 39POS 2.54MM Samtec Inc. |
3,874 |
|
Tabla de datos |
Flex Stack, HMTSW | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 39 | 3 | 0.100" (2.54mm) | All | Board to Board or Cable | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | 0.200" (5.08mm) | - | - | 0.319" (8.10mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 3A |
|
LTMM-107-01-S-D-SM-PCONN HEADER SMD 14POS 2MM Samtec Inc. |
3,278 |
|
- |
Flex Stack, LTMM | Tube | Active | Header | Male Pin | 0.079" (2.00mm) | 14 | 2 | 0.079" (2.00mm) | All | Board to Board | Shrouded - 4 Wall | Surface Mount | Solder | Push-Pull | 0.100" (2.54mm) | - | - | 0.190" (4.83mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot, Pick and Place | - |
|
TSS-115-04-S-D-RA-08CONN HEADER R/A 30POS 2.54MM Samtec Inc. |
2,770 |
|
Tabla de datos |
Flex Stack, TSS | Tube | Active | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - |
|
HTSS-107-01-H-DCONN HEADER VERT 14POS 2.54MM Samtec Inc. |
2,017 |
|
- |
Flex Stack, HTSS | Bulk | Active | Header | Male Pin | 0.100" (2.54mm) | 14 | 2 | 0.100" (2.54mm) | All | Board to Board or Cable | Shrouded - 4 Wall | Through Hole | Solder | Push-Pull | 0.250" (6.35mm) | 0.115" (2.92mm) | 0.480" (12.19mm) | 0.350" (8.89mm) | Square | Gold | Gold | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Keying Slot | - |
|
IPT1-111-01-S-D-VSCONN HEADER SMD 22POS 2.54MM Samtec Inc. |
2,774 |
|
- |
Mini Mate® IPT1 | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 22 | 2 | 0.100" (2.54mm) | All | Board to Board | Shrouded - 4 Wall | Surface Mount | Solder | Push-Pull | 0.155" (3.94mm) | - | - | 0.250" (6.35mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 2.3A per Contact |
|
TST-109-04-H-D-RACONN HEADER R/A 18POS 2.54MM Samtec Inc. |
2,819 |
|
- |
Flex Stack, TST | Tube | Active | Header | Male Pin | 0.100" (2.54mm) | 18 | 2 | 0.100" (2.54mm) | All | Board to Cable/Wire | Shrouded - 4 Wall | Through Hole, Right Angle | Solder | Push-Pull | 0.250" (6.35mm) | 0.130" (3.30mm) | - | 0.365" (9.27mm) | Square | Gold | Gold | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | Keying Slot | 3.4A per Contact |
|
T2M-110-01-S-D-SM-WT-KCONN HEADER SMD 20POS 2MM Samtec Inc. |
3,773 |
|
- |
Tiger Eye™ T2M | Bulk | Active | Header | Male Pin | 0.079" (2.00mm) | 20 | 2 | 0.079" (2.00mm) | All | Board to Board or Cable | Shrouded - 4 Wall | Surface Mount | Solder | Push-Pull | - | - | - | 0.228" (5.80mm) | Square | Gold | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Pick and Place, Solder Retention | 3.8A |
|
HFWJ-19-04-T-S-RA.156" HIGH-TEMP POWER TERMINAL S Samtec Inc. |
2,409 |
|
Tabla de datos |
HFWJ | Bulk | Active | Header | Male Pin | 0.156" (3.96mm) | 19 | 1 | - | All | Board to Board | Unshrouded | Through Hole, Right Angle | Solder | Push-Pull | - | 0.156" (3.96mm) | - | 0.250" (6.35mm) | Square | Tin | Tin | Phosphor Bronze | Liquid Crystal Polymer (LCP) | - | 6.7A per contact |