Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Paquete/Caja | Embalaje | Estado del producto | Aplicaciones | Corriente - Suministro | Voltaje - Suministro | Temperatura de funcionamiento | Grado | Calificación | Tipo de montaje | Proveedor Dispositivo Paquete |
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MC33FS6507NAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS5502Y3KSR2HIGH VOLTAGE POWER MANAGEMENT IC NXP USA Inc. |
0 |
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- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | SMPS Start-Up | - | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MC33FS5502Y0KSR2HIGH VOLTAGE POWER MANAGEMENT IC NXP USA Inc. |
0 |
|
![]() Tabla de datos |
- | 56-VFQFN Exposed Pad | Tape & Reel (TR) | Active | SMPS Start-Up | - | 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 56-HVQFN (8x8) |
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MFS8601BMBA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
0 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 60V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
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MC35FS4500NAER2FS4500 NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 150°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MC33FS4502NAER2SYSTEM BASIS CHIP LINEAR 0.5A V NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C | - | - | Surface Mount | 48-HLQFP (7x7) |
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MC34VR5100A0EPIC REG 9OUT BUCK/LDO 48QFN NXP USA Inc. |
0 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | LS1 Communication Processors | 450µA | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 48-HVQFN (7x7) |
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MC34VR5100A2EPIC REG 9OUT BUCK/LDO 48QFN NXP USA Inc. |
0 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | LS1 Communication Processors | 450µA | 2.8V ~ 4.5V | -40°C ~ 105°C (TA) | - | - | Surface Mount | 48-HVQFN (7x7) |
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MFS8630BMDA0ESIC FS86 SYSTEM BASIS CHIP ASIL NXP USA Inc. |
0 |
|
- |
- | 48-VFQFN Exposed Pad | Tray | Active | Camera | - | 4.5V ~ 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-QFN (7x7) |
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MC33PF3000A0ESR2POWER MANAGEMENT IC I.MX7 PRE- NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | i.MX Processors | - | 2.8V ~ 5.5V | -40°C ~ 105°C | - | - | Surface Mount, Wettable Flank | 48-QFN (7x7) |