Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Paquete/Caja | Embalaje | Estado del producto | Aplicaciones | Corriente - Suministro | Voltaje - Suministro | Temperatura de funcionamiento | Grado | Calificación | Tipo de montaje | Proveedor Dispositivo Paquete |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MPF5030BMMA0ESPMIC 3 BUCKS 2 LDO A1 DIE NXP USA Inc. |
0 |
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- | 40-PowerVFQFN | Tray | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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MC33FS6525NAER2SYSTEM BASIS CHIP, DCDC 2.2A VCO NXP USA Inc. |
0 |
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- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |
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MFS2601AMBA0ADR2AUTO SBC NXP USA Inc. |
0 |
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- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | 30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MFS2610AMBA0ADR2AUTO SBC NXP USA Inc. |
0 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | 30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MFS2620AMBA0ADR2AUTO SBC NXP USA Inc. |
0 |
|
![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | - | 30µA | 3.2V ~ 40V | -40°C ~ 125°C (TA) | Automotive | - | Surface Mount | 48-LQFP-EP (7x7) |
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MPF5032BMDA0ESPMIC 2 BUCKS 2 LDO NXP USA Inc. |
0 |
|
![]() Tabla de datos |
- | 40-PowerVFQFN | Tray | Active | System Basis Chip | - | 3.3V ~ 5.25V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 40-HVQFN (6x6) |
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UJA1131HW/5V0,518IC TRANSCEIVER NXP USA Inc. |
0 |
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- | 48-TQFP Exposed Pad | Tape & Reel (TR) | Last Time Buy | - | 2.8mA | 2V ~ 28V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HTQFP (10x10) |
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MFS8632BMBA0ESR2SAFETY SYSTEM BASIS CHIP FOR DOM NXP USA Inc. |
0 |
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- | 48-VFQFN Exposed Pad | Tape & Reel (TR) | Active | Camera | - | 36V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount, Wettable Flank | 48-HVQFN (7x7) |
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MC13892VLR2IC PMU I.MX51/37/35/27 186MAPBGA NXP USA Inc. |
0 |
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- |
- | 186-LFBGA | Tape & Reel (TR) | Obsolete | Battery Management, Display (LED Drivers), Handheld/Mobile Devices, Power Supply | - | - | -40°C ~ 85°C | - | - | Surface Mount | 186-PBGA (12x12) |
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MC33FS6505CAER2SYSTEM BASIS CHIP, DCDC 0.8A VCO NXP USA Inc. |
0 |
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![]() Tabla de datos |
- | 48-LQFP Exposed Pad | Tape & Reel (TR) | Active | System Basis Chip | - | 1V ~ 5V | -40°C ~ 125°C (TA) | Automotive | AEC-Q100 | Surface Mount | 48-HLQFP (7x7) |