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| Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Paquete/Caja | Serie | Embalaje | Estado del producto | Programable | Tipo | Tipo de entrada | Tipo de salida | Corriente - Suministro | Temperatura de funcionamiento | Grado | Calificación | Tipo de montaje | Proveedor Dispositivo Paquete |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
ZSSC3241DI1CWAFER (SAWN) - FRAME Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DI5BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DL5BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DI5CWAFER (SAWN) - FRAME Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DL1BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DI1BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3241DL5CWAFER (SAWN) - FRAME Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tape & Reel (TR) | Active | - | Signal Conditioner | Analog, Digital | 1-Wire®, I2C, SPI | 18 mA | -40°C ~ 125°C (TA) | - | - | Surface Mount | Wafer |
|
|
ZSSC3240CC6BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tray | Active | - | Signal Conditioner | Analog | 1-Wire®, I2C, SPI | 2.8 mA | -40°C ~ 85°C (TA) | - | - | Surface Mount | Die |
|
|
ZSSC3240CC5BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tray | Active | - | Signal Conditioner | Analog | 1-Wire®, I2C, SPI | 2.8 mA | -40°C ~ 85°C (TA) | - | - | Surface Mount | Die |
|
|
ZSSC3240CC2BWAFER (UNSAWN) - WAFER BOX Renesas Electronics Corporation |
0 |
|
Tabla de datos |
Die | - | Tray | Active | - | Signal Conditioner | Analog | 1-Wire®, I2C, SPI | 2.8 mA | -40°C ~ 85°C (TA) | - | - | Surface Mount | Die |
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