Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Paquete/Caja | Serie | Embalaje | Estado del producto | Programable | Procesador central | Tamaño de núcleo | Velocidad | Conectividad | Periféricos | Número de E/S | Tamaño de memoria de programa | Tipo de memoria de programa | Tamaño de EEPROM | Tamaño de RAM | Voltaje - Alimentación (Vcc/Vdd) | Convertidores de datos | Tipo de oscilador | Temperatura de funcionamiento | Grado | Calificación | Tipo de montaje | Proveedor Dispositivo Paquete |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
CYT3DLBBEBQ1BZSGSIC MCU 32BIT 4.063MB FLSH 272BGA Infineon Technologies |
960 |
|
- |
272-LFBGA | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Dual-Core | 240MHz | DMA, I2S, LVD, Temp Sensor, WDT | DMA, I2S, LVD, Temp Sensor, WDT | 135 | 4.063MB (4.063M x 8) | FLASH | 128K x 8 | 384K x 8 | 2.7V ~ 5.5V | - | - | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
![]() |
CYT4BFCCHDQ0BZEGSIC MCU 32BT 8.1875MB FLSH 320BGA Infineon Technologies |
900 |
|
![]() Tabla de datos |
320-LFBGA | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 32-Bit Quad-Core | 100MHz, 350MHz | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 240 | 8.1875MB (8.1875M x 8) | FLASH | 256 x 8 | 1M x 8 | 2.7V ~ 5.5V | A/D 114x12b SAR | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
![]() |
CYT3DLBBGBQ1BZSGSIC MCU 32BIT 4.063MB FLSH 272BGA Infineon Technologies |
960 |
|
- |
272-LFBGA | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Dual-Core | 240MHz | DMA, I2S, LVD, Temp Sensor, WDT | DMA, I2S, LVD, Temp Sensor, WDT | 135 | 4.063MB (4.063M x 8) | FLASH | 128K x 8 | 384K x 8 | 2.7V ~ 5.5V | - | - | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
|
TC233LP32F200FACKXUMA1IC MCU 32BIT 2MB FLASH 100TQFP Infineon Technologies |
993 |
|
![]() Tabla de datos |
100-TQFP Exposed Pad | AURIX™ | Tape & Reel (TR) | Active | Not Verified | TriCore™ | 32-Bit Single-Core | 200MHz | CANbus, FlexRay, LINbus, QSPI | DMA, WDT | 78 | 2MB (2M x 8) | FLASH | 128K x 8 | 192K x 8 | 3.3V | A/D 24x12b | External | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
![]() |
CYT4A0100DQ0AESGSIC MCU Infineon Technologies |
400 |
|
![]() Tabla de datos |
- | - | Tray | Active | Not Verified | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | |
![]() |
CYT4BF8CEDQ0AESGSIC MCU 32BT 8.1875MB FLSH 176QFP Infineon Technologies |
398 |
|
![]() Tabla de datos |
176-LQFP Exposed Pad | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M4F | 32-Bit Quad-Core | 100MHz, 350MHz | CANbus, EBI/EMI, I2C, LINbus, SPI, UART/USART | Brown-out Detect/Reset, DMA, POR, PWM, WDT | 148 | 8.1875MB (8.1875M x 8) | FLASH | 256 x 8 | 1M x 8 | 2.7V ~ 5.5V | A/D 99x12b SAR | Internal | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
|
TC234LP32F200FACKXUMA1IC MCU 32BIT 2MB FLASH 144TQFP Infineon Technologies |
680 |
|
![]() Tabla de datos |
144-LQFP Exposed Pad | AURIX™ | Tape & Reel (TR) | Active | Not Verified | TriCore™ | 32-Bit Single-Core | 200MHz | CANbus, FlexRay, LINbus, QSPI | DMA, WDT | 120 | 2MB (2M x 8) | FLASH | 128K x 8 | 192K x 8 | 3.3V | A/D 24x12b | External | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
![]() |
TC212S8F133SCACKXUMA1IC MCU 32BIT 512KB FLASH 80TQFP Infineon Technologies |
1,800 |
|
![]() Tabla de datos |
80-TQFP Exposed Pad | AURIX™ | Tape & Reel (TR) | Active | Not Verified | TriCore™ | 32-Bit Single-Core | 133MHz | CANbus, LINbus, QSPI | DMA, WDT | 59 | 512KB (512K x 8) | FLASH | 64K x 8 | 56K x 8 | 3.3V | A/D 24x12b | External | -40°C ~ 125°C (TA) | - | - | Surface Mount | |
![]() |
CYT4DNJBRCQ1BZSGSIC MCU 32BIT 6.188MB FLSH 327BGA Infineon Technologies |
876 |
|
![]() Tabla de datos |
327-BGA | Traveo™ T2G | Tray | Active | Not Verified | ARM® Cortex®-M0+, ARM® Cortex®-M7F | 32-Bit Quad-Core | 320MHz | DMA, I2S, LVD, Temp Sensor, WDT | DMA, I2S, LVD, Temp Sensor, WDT | 168 | 6.188MB (6.188M x 8) | FLASH | 128K x 8 | 640K x 8 | 2.7V ~ 5.5V | - | - | -40°C ~ 105°C (TA) | - | - | Surface Mount | |
![]() |
S6J32LELSMSC20000TRAVEO-55NM Infineon Technologies |
400 |
|
![]() Tabla de datos |
216-LQFP Exposed Pad | Traveo S6J3200 | Tray | Active | - | ARM® Cortex®-R5F | 32-Bit | 240MHz | CANbus, CSIO, Ethernet, I2C, LINbus, SPI, UART/USART | DMA, I2S, LCD, LVD, POR, PWM, WDT | 128 | 4.171875MB (4.171875M x 8) | FLASH | - | 3M x 8 | 1.15V ~ 5.5V | A/D 50x12b | Internal | -40°C ~ 105°C (TA) | - | - | Surface Mount |