Foto | N.º de Parte del Fabricante | Disponibilidad | Cantidad | Hoja de Datos | Serie | Embalaje | Estado del producto | Tipo de tarjeta | Género | Número de posiciones/bahía/fila | Número de posiciones | Grosor de la tarjeta | Número de filas | Paso | Lectura | Características | Tipo de montaje | Terminación | Material de contacto | Acabado de contacto | Grosor del acabado del contacto | Tipo de contacto | Color | Característica de la brida | Temperatura de funcionamiento |
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MEC8-150-02-SM-DV-ACONN EDGE DUAL FML 100POS 0.031 Samtec Inc. |
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MEC8 - DV | Tray | Active | Non Specified - Dual Edge | Female | - | 100 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide | Surface Mount | Solder | Phosphor Bronze | Gold | 30.0µin (0.76µm) | Hairpin Bellows | Black | - | -55°C ~ 125°C |
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PCIE-G4-16-01-L-DV-A-K1.00 MM PCI EXPRESS GEN 3 EDGE C Samtec Inc. |
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PCI Express® (PCIe) | Tray | Active | PCI Express™ | Female | 11; 71 | 164 | 0.062" (1.57mm) | 2 | 0.039" (1.00mm) | Dual | Board Guide, Pick and Place | Surface Mount | Solder | Copper Alloy | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
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HSEC8-190-03-L-DV-A-WT-K0.80 MM HIGH-SPEED POWER/SIGNAL Samtec Inc. |
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Edge Rate™ HSEC8 | Tray | Active | PCI Express™ | Female | 28; 62 | 180 | 0.093" (2.36mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Pick and Place, Solder Retention | Surface Mount | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
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HSEC8-190-01-L-DV-ACONN EDGE DUAL FML 180POS 0.031 Samtec Inc. |
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Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 90 | 180 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Locking Ramp | Surface Mount | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
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HSEC8-130-01-L-PV-4-1-WTCONN EDGE DUAL FML 64POS 0.031 Samtec Inc. |
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Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 30; 2; 2 | 64 (60 + 4 Power) | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Solder Retention | Surface Mount, Through Hole | Solder | Beryllium Copper | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
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MEC8-120-02-S-D-EM2CONN EDGE DUAL FMALE 40POS 0.031 Samtec Inc. |
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MEC8 - EM | Tube | Active | Non Specified - Dual Edge | Female | - | 40 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | - | Board Edge, Straddle Mount | Solder | Phosphor Bronze | Gold | 30.0µin (0.76µm) | Hairpin Bellows | Black | - | -55°C ~ 125°C |
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MEC8-120-01-S-D-EM2CONN EDGE DUAL FMALE 40POS 0.031 Samtec Inc. |
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MEC8 - EM | Tube | Active | Non Specified - Dual Edge | Female | - | 40 | 0.039" (1.00mm) | 2 | 0.031" (0.80mm) | Dual | - | Board Edge, Straddle Mount | Solder | Phosphor Bronze | Gold | 30.0µin (0.76µm) | Hairpin Bellows | Black | - | -55°C ~ 125°C |
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HTEC8-1100-01-L-DV-A-K0.80 MM RUGGED HIGH-SPEED EDGE C Samtec Inc. |
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Edge Rate™ HTEC8 | Tray | Active | PCI Express™ | Female | 100 | 200 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Pick and Place | Surface Mount | Solder | Copper Alloy | Gold | 10.0µin (0.25µm) | Cantilever | Black | - | -55°C ~ 125°C |
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HSEC8-160-01-S-DV-A-BL-KCONN EDGE DUAL FML 120POS 0.031 Samtec Inc. |
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Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 60 | 120 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Board Lock | Surface Mount | Solder | Beryllium Copper | Gold | 30.0µin (0.76µm) | Cantilever | Black | - | -55°C ~ 125°C |
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HSEC8-160-01-SM-DV-A-BL-KCONN EDGE DUAL FML 120POS 0.031 Samtec Inc. |
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![]() Tabla de datos |
Edge Rate™ HSEC8 | Tray | Active | Non Specified - Dual Edge | Female | 60 | 120 | 0.062" (1.57mm) | 2 | 0.031" (0.80mm) | Dual | Board Guide, Board Lock | Surface Mount | Solder | Beryllium Copper | Gold | 30.0µin (0.76µm) | Cantilever | Black | - | -55°C ~ 125°C |